1. Introduction to high-speed
    digital design
2. Time & frequency
    Domain measurements
3. Capacitance
4. Inductance
5. Crosstalk
6. Crosstalk review, quiescent power
    dissipation
7. Power dissipation in CMOS devices
8. Power dissipation in ECL devices
9. Noise margin, propagation delay
10. Ground bounce, packaging
11. High-frequency measurements
12. Using voltage, current and
      near-field probes
13. Review of lectures 1-12
14. Exam I problem discussion
15. Time-domain transmission lines
16. Pulse-bounce diagrams
17. Inductive and capacitive terminations
18. Lumped elements in the middle of
      transmission lines
19. Frequency-domain transmission lines
20. Time-domain reflectometry
21. Source, end and mid-line terminations
22. Printed circuit board construction
23. Review of lectures 15-22
24. Exam II problem discussion
25. Differential signaling, sources of skew
26. Least impedance paths, field
      containment
27. Grounding
28. Crosstalk measurements
29. Working with differential signals
30. Printed circuit board decoupling I
31. Printed circuit board decoupling II
32. Power distribution, power islands
33. 4-layer board decoupling,
      via mutual inductance
34. Examples and discussion
35. Review of lectures 25-34
36. Exam III problem discussion
37. Low-pass filter lab, lossy
      transmission lines
38. Data transmission standards
39. The rest of what you need to know
40. Review for final exam